Micron Memory Part Number Decoder

Understanding Micron’s complex alphanumeric part numbers is essential for ensuring hardware compatibility. Because Micron memory chips are often too small for full part numbers, the company uses a system of FBGA codes on the physical hardware that maps back to a comprehensive Marketing Part Number (MPN). The Two-Step Decoding Process 1. Decoding FBGA Codes (Hardware Level)

LPDDR/DDR5 differences

  • LPDDR uses different family codes and often includes IO voltage and low-power characteristics explicitly.
  • DDR5 part numbers encode additional features (on-die ECC, PMIC presence) — expect longer suffixes and different letters.

) laser-etched directly onto the tiny memory chips because the full MPN won't fit. To bridge this gap, you can use the official Micron FBGA and Component Marking Decoder micron memory part number decoder

  • 128M (128 megabits)
  • 512M (512 megabits)
  • 1G (1 gigabit)

Breakdown:

| Position | Code | Meaning | | :--- | :--- | :--- | | Prefix | MT | Micron Technology (Standard Memory) | | Type | 4 | DRAM (Dynamic RAM) | | | H | Hybrid Memory Cube (HMC) | | Density | 4G | 4 Gigabits | | | 8G | 8 Gigabits | | | 16G | 16 Gigabits | | | 40 | 4 Gigabits (Alt designation) | | | 80 | 8 Gigabits (Alt designation) | | Generation | A | SDR SDRAM | | | B | DDR SDRAM | | | C | DDR2 SDRAM | | | D | DDR3 SDRAM | | | E | DDR4 SDRAM | | | F | DDR5 SDRAM | | | H | LPDDR / LPDDR2 / LPDDR3 / LPDDR4 / LPDDR5 | | | J | GDDR5 / GDDR5X / GDDR6 | | | V | RLDRAM (Reduced Latency) | | | T | Mobile LPDRAM (Low Power) | | Speed | (Varies) | Data Transfer Rate | | | DDR4 Examples: AT (DDR4-2133), 8G (DDR4-3200) | | | DDR5 Examples: BG (DDR5-4800), CK (DDR5-5600) | | | See speed tables below | | Org | 08 | x8 (8-bit wide data bus) | | | 16 | x16 (16-bit wide data bus) | | | 04 | x4 (4-bit wide data bus) | | Package | G | FBGA (Fine-pitch Ball Grid Array) | | | J | BGA (Standard Ball Grid Array) | | | M | TSOP (Thin Small Outline Package) | | Temp Grade | C | Commercial (0°C to +70°C) | | | I | Industrial (-40°C to +85°C) | | | E | Extended (-25°C to +85°C) | | | A | Automotive (-40°C to +95°C) | | | IT | Industrial Temperature (Often used in newer parts) | | Process/Rev| -XX | Die Revision or Manufacturing Process Code (e.g., -093, -AAT) | LPDDR uses different family codes and often includes

Pro tip: To get the total chip capacity in Gigabytes, divide by 8. (512Mbit / 8 = 64MByte per chip). ) laser-etched directly onto the tiny memory chips

Marking Variations: Full part numbers are often found on stickers on the module, while abbreviated codes are laser-etched directly onto the individual ICs (integrated circuits). If you'd like to dive deeper, I can help you: Decode a specific part number you currently have.